Notes:
All electrical characteristics are measured at 25°C.
VDM measured per UL497B pulse requirements: at max. off-state leakage current (IDM) = 5 µA.
VBO measured at 100V/µs
Symbol
Parameter
Definition
VDM
Maximum off-state
voltage
Maximum DC voltage that can be applied to the device while maintaining
it in the off-state condition.
VBO
Breakover voltage
Maximum voltage across the device at breakdown measured under a
specified voltage and current rate of rise.
IH
Hold current
Minimum current required to maintain the device in the on-state.
VT
On-state voltage
Voltage across the device in the on-state condition at a specified current (IT).
IDM
Off-state current
Maximum DC value of current that results from the application of the maximum
off-state voltage.
附加的产品信息
元件编号说明
安规认证
Standard
Title
File Number
UL
Transient Voltage Surge Suppressors
E179610
推荐焊盘尺寸
Part
Description
Tape and Reel
Quantity
Standard
Package
Recommended Pad Layout (millimeters/ inches)
Dimension
A (Nom.)
Dimension
B (Nom.)
Dimension
C (Nom.)
TVAxxxSA-L
5,000
20,000
2.000 (0.079)
2.000 (0.079)
2.000 (0.079)
TVAxxxNSA-L
5,000
20,000
2.000 (0.079)
2.000 (0.079)
2.000 (0.079)
TVAxxxRSA-L
5,000
20,000
2.000 (0.079)
2.000 (0.079)
2.000 (0.079)
TVBxxxSA-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVBxxxNSA-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVBxxxRSA-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVB006SB-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVBxxxSB-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVBxxxNSB-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVBxxxMSB-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVBxxxSC-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVBxxxNSC-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVBxxxMSC-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
TVBxxxRSC-L
2,500
10,000
2.261 (0.089)
2.159 (0.085)
2.743 (0.108)
推荐回流焊接和返工
Solder Reflow and Rework Recommendations for SiBar Thyristor Surge Protectors
SiBar thyristor devices are compatible with standard reflow and wave soldering techniques.
Solder Reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Always preheat the device to prevent excessive thermal shock and stress.
• Recommended maximum paste thickness of 0.25mm (0.010 in.).
• Devices may be cleaned using standard industry methods and solvents.
Solder Rework
• Use standard industry practices for the SiBar Thyristor Surge Protectors.